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CHT have over 40 years’ experience manufacturing 1-Part
adhesives for high performance applications. Using a variety
of cure mechanisms, modifications can be made to the
rheology, hardness, elasticity, cure speed, extrusion rate and
compatibility with substrates.
POTTING AND ENCAPSULATION COMPOUNDS
TDS
CHT have many products available for the general potting and
encapsulation of electronic components. A range of hardnesses
enable careful product selection ensuring that components are
not damaged by thermal expansion during extreme temperature
cycling.
Products:
`` UL 94 V-0 Approved
`` Opaque and Optically Clear
`` RTV and Heat Cured
`` High Temperature to + 300 °C
MIL-A-46146B GRADES
Tested to meet the demanding MIL-A-46146B standard,
this range of products have exceptional strength making them
ideal for the most demanding of applications.
`` High strength
`` Fast cure and skinning times
`` Wide Temperature -60°C to +316°C
`` Flowable and Paste
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