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CHT have over 40 years’ experience manufacturing 1-Part
adhesives for high performance applications. Using a variety
of cure mechanisms, modifications can be made to the
rheology, hardness, elasticity, cure speed, extrusion rate and
compatibility with substrates.

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POTTING AND ENCAPSULATION COMPOUNDS

TDS 

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CHT have many products available for the general potting and
encapsulation of electronic components. A range of hardnesses
enable careful product selection ensuring that components are
not damaged by thermal expansion during extreme temperature
cycling.

Products:
`` UL 94 V-0 Approved
`` Opaque and Optically Clear
`` RTV and Heat Cured
`` High Temperature to + 300 °C

MIL-A-46146B GRADES
Tested to meet the demanding MIL-A-46146B standard,
this range of products have exceptional strength making them
ideal for the most demanding of applications.

`` High strength
`` Fast cure and skinning times
`` Wide Temperature -60°C to +316°C
`` Flowable and Paste

 

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